PRODUCT NUMBERRR-H410-20PC-R1CPU SOCKETLGA2066, LGA2011-v3, LGA2011, LGA1200, LGA1151, LGA1150, LGA1155, LGA1156, LGA1366, AM4, AM3+, AM3, AM2+, AM2, FM2+, FM2, FM1DIMENSIONS (L X W X H)102 x 83.4 x 136 mm / 4.0 x 3.3 x 5.4 inchHEAT SINK DIMENSIONS (L X W X H)90 x 63.5 x 136 mm / 3.5 x 2.5 x 5.4 inc..
CPU SOCKETLGA2066, LGA2011-v3, LGA2011, LGA1200, LGA1151, LGA1150, LGA1155, LGA1156, LGA1366, LGA775, AM4, AM3+, AM2+, AM2, FM2+, FM2, FM1DIMENSIONS (L X W X H)130.9 x 112.8 x 166.5 mm / 5.2 x 4.4 x 6.5 inchHEAT SINK DIMENSIONS (L X W X H)116 x 60 x 158 mm / 4.5 x 2.4 x 6.2 inchHEAT SINK MATERIAL6 H..
CPU
SOCKET
LGA2066, LGA2011-v3,
LGA2011, LGA1366, LGA1200, LGA1156, LGA1155, LGA1151, LGA1150, LGA775, AM4,
AM3+, AM3, AM2+, AM2, FM2+, FM2, FM1
HEAT
SINK DIMENSIONS (L X W X H)
116 x 110.1 x 165 mm /
4.6 x 4.3 x 6.5 inch
HEAT
SINK MATERIAL
6 Heat Pipes, CDC 2.0,
Aluminum Fins
..
PRODUCT
NUMBERMFL-B2DW-18NPA-R1FAN
PROFILEAddressable Gen 2 RGBFAN
SPEED650-1800 RPM (PWM) ± 10%FAN
AIRFLOW47.2 CFM ± 10%FAN
AIR PRESSURE1.6 mmH2O ± 10%FAN
NOISE LEVEL6 - 30 dBAFAN
DIMENSIONS (L X W X H)120 x 120 x 25 mm / 4.7 x 4.7 x 1 inchFAN
MTTF160,000 HoursFAN
BEARING TYPERifle Bearing..
PRODUCT
NUMBERMFY-B2DN-20NPA-R1FAN
PROFILEAddressable RGBFAN
BEARING TYPERifle BearingFAN
SPEED650-2000 RPM ± 5%FAN
AIRFLOW55 CFM (Max)FAN
AIR PRESSURE2.91 mmH2O (Max)FAN
NOISE LEVEL8 - 27 dBAFAN
DIMENSIONS (L X W X H)120 x 120 x 25 mm / 4.7
x 4.7 x 1 inchFAN
MTTF160,000 HoursRGB
CONNECTO..
FAN
PROFILEAddressable Gen 2 RGBFAN
BEARING TYPERifle BearingFAN
SPEED650-2000 RPM ± 5%FAN
AIRFLOW55 CFM (Max)FAN
AIR PRESSURE2.91 mmH2O (Max)FAN
NOISE LEVEL8 - 27 dBAFAN
DIMENSIONS (L X W X H)120 x 120 x 25 mm / 4.7 x 4.7 x 1 inchFAN
MTTF160,000 HoursRGB
CONNECTOR3-Pin ARGBRGB
RATED VOLTA..
Mastergel RegularHigh Performance Thermal CompoundIntroducing our New Edition MasterGelSeries, with our new exclusive flat-nozzle syringe design which enhances the user experience by making the application process as simple as possible. This new design eliminates the process of having to use a scrap..
HIGH THERMAL CONDUCTIVITY – At 9 W/mK., the MasterGel Pro V2 employs a demonstrably superior compound formula for outstanding thermal conductivity between the chipset and cooler base.ZERO ELECTRICAL CONDUCTIVITY - Prevents CPU or GPU short circuiting by completely eliminating the risk of electrical ..